Download PDF by Khaled Salah,Yehea Ismail,Alaa El-Rouby: Arbitrary Modeling of TSVs for 3D Integrated Circuits

By Khaled Salah,Yehea Ismail,Alaa El-Rouby

This e-book provides a wide-band and expertise self reliant, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version bills for quite a few results, together with epidermis impression, depletion capacitance and within reach touch results. Readers will reap the benefits of in-depth insurance of strategies and expertise comparable to 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics. suggestions coated are established by utilizing TSVs in functions corresponding to a spiral inductor and inductive-based conversation method and bandpass filtering.

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Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) by Khaled Salah,Yehea Ismail,Alaa El-Rouby

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